Huawei Expected to Break Semiconductor Barriers with Development of High-End 3nm GAA Chips; Tape-Out by 2026
https://wccftech.com/huawei-expected-to-break-semiconductor-barriers-with-development-of-high-end-3nm-gaa-chips-tape-out-by-2026/
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1 Comments
golli@lemm.ee · 3 pts · 1y
I'm curious to see how this claim eventually turns out. I kind of doubt it'll be a true 3nm class chip without EUV, but regardless I am sure they are making some decent progress.