Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck

https://www.tomshardware.com/tech-industry/semiconductors/intel-patent-reveals-new-xbm-memory-architecture-that-ditches-hbms-costly-silicon-interposer-backend-transistor-dram-stack-uses-ucie-links-and-built-in-repair-to-ease-ais-memory-bottleneck