3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers — passive design provides reusable heat, exceeds project performance expectations by 50%

The articles claim no pump or fan.

The developed cooling solution is based on a passive two-phase thermosiphon principle. A coolant evaporates at the hot surface of the computer chip, absorbing heat before the vapor rises due to density differences. The vapor then condenses elsewhere in the system, releasing heat, and returns as liquid through gravity. Because this process occurs passively, no pumps are required, resulting in no additional energy consumption for heat removal.

The key component in the system is an evaporator, which was developed and manufactured using additive manufacturing. By 3D printing the evaporator in aluminum as a single integrated component, the design eliminates assembly points and reduces the risk of leaks, improving overall reliability. The single-material design also simplifies recycling at the end of the component’s lifecycle.

Though the comment about condensing elsewhere and releasing heat seems like a place I’d expect to see fans in a setup like this, not that I’m any kind of expert.